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Updated on: 6th Sep 2023

ENG328 VLSI Design 2 SUSS Assignment Sample Singapore

ENG328 VLSI Design 2 is a course that builds upon the concepts learned in ENG327 VLSI Design 1. The course focuses on the design and implementation of digital circuits using Verilog hardware description language. The course covers advanced topics in VLSI design such as timing analysis, power optimization, and design for testability.

Throughout the course, students will learn how to design, simulate, and synthesize digital circuits using industry-standard tools. They will also gain experience in working with programmable logic devices (PLDs) and field-programmable gate arrays (FPGAs).

By the end of the course, students will have a strong understanding of advanced VLSI design techniques and be able to apply them to real-world digital circuit design problems. This course is typically taken by students in electrical engineering, computer engineering, and related fields.

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Assignment Task 1: Design a combination circuit using various circuit families (e.g. CMOS, Ratioed Circuit, CVSL, etc.).

One possible design of a combination circuit using various circuit families is a 4-bit ripple carry adder. This circuit can be designed using a combination of CMOS and ratioed circuit families. Here’s an overview of the design:

  1. CMOS inverters are used to buffer the inputs and the carry-in signal.
  2. CMOS NAND gates are used to generate the sum and carry-out signals for each bit.
  3. Ratioed circuits, specifically transmission gates, are used to control the flow of signals between different parts of the circuit.
  4. The circuit is designed to be a ripple carry adder, which means that each bit’s sum and carry-out signals depend on the input signals and the carry-in signal for the previous bit.

Assignment Task 2: Indicate the circuit pitfalls and revise the circuit for robustness.

There are a few potential pitfalls that can occur when designing and implementing circuits. First, if the circuit is not designed correctly, it can result in poor performance or even complete failure. Second, if the components used in the circuit are not of good quality, they can also cause problems. Finally, if the circuit is not properly implemented, it can also lead to issues.

To avoid these potential problems, it is important to design the circuit correctly from the start. This means using quality components and following best practices for implementation. Additionally, it is important to test the circuit thoroughly before putting it into production. By doing so, you can ensure that it will perform as intended and be robust against potential issues.

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Assignment Task 3: Analyze the given sequential circuit using the various analysis and circuit design techniques.

Sequential circuits are digital circuits that have memory elements, such as flip-flops, that store the state of the circuit. The output of the circuit depends on the current state of the circuit and the inputs. Sequential circuits can be synchronous or asynchronous.

Synchronous sequential circuits have a clock signal that controls when the state of the circuit changes. Asynchronous sequential circuits do not have a clock signal and the state of the circuit can change at any time.

There are several methods for analyzing sequential circuits. These methods can be used to find the maximum clock frequency, to find the minimum number of flip-flops needed, or to find the best way to implement a sequential circuit.

Assignment Task 4: Examine the operation and characteristics of circuit elements, and various testing techniques used for IC chip testing (e.g. BIST, scan, boundary scan, etc.).

Circuit Elements:

Circuit elements are the basic components that make up electronic circuits. These components can be divided into two broad categories: passive and active components.

Passive components include resistors, capacitors, and inductors. They are called passive because they do not require an external power source to function. Instead, they rely on the properties of their materials to store or resist energy.

Active components include transistors, diodes, and integrated circuits (ICs). They are called active because they require an external power source to function. They are used to amplify, switch, or regulate electrical signals.

Characteristics of Circuit Elements:

Each circuit element has its own unique set of characteristics that determine how it functions within a circuit. Some of the key characteristics include:

  1. Resistance: This is the measure of how much a resistor opposes the flow of electrical current. It is measured in ohms (Ω).
  2. Capacitance: This is the measure of a capacitor’s ability to store electrical energy. It is measured in farads (F).
  3. Inductance: This is the measure of an inductor’s ability to store magnetic energy. It is measured in henries (H).
  4. Voltage: This is the measure of the electrical potential difference between two points in a circuit. It is measured in volts (V).
  5. Current: This is the measure of the flow of electrical charge through a circuit. It is measured in amperes (A).

IC Chip Testing Techniques:

IC chip testing is a crucial step in the manufacturing process of electronic devices. There are several testing techniques used to ensure the quality and reliability of IC chips. Some of the most commonly used techniques include:

  1. Built-in self-test (BIST): This is a testing technique that is built into the IC chip itself. The BIST circuitry is used to perform tests on the chip’s functional blocks, such as logic gates or memory cells.
  2. Scan Testing: This technique involves adding test circuitry to the IC chip. The test circuitry allows for the individual testing of each component within the chip.
  3. Boundary Scan Testing: This technique involves adding test circuitry to the periphery of the IC chip. The test circuitry is used to perform tests on the chip’s input/output (I/O) pins.
  4. Functional Testing: This technique involves testing the IC chip under normal operating conditions to ensure that it performs as expected.
  5. In-Circuit Testing: This technique involves testing the IC chip while it is installed in the final product. This allows for more comprehensive testing of the chip’s functionality.

Assignment Task 5: Estimate the timing parameters, transistor size and other parameters involved in circuit design.

 

As an electrical engineer, one of the most important things you can do is estimate the timing parameters for your transistor sizes and other parameters involved in your circuit design. This is because if your estimate is off, it could mean the difference between your circuit working correctly or not.

There are a few different ways that you can estimate these parameters. One way is to use a tool like Spice. Spice is a software tool that can help you simulate your circuit and estimate the timing parameters.

Another way to estimate the timing parameters is to use something called a delay calculator. A delay calculator is a tool that allows you to input the parameters of your circuit and then outputs an estimated delay.

The last way to estimate the timing parameters is to use a rule of thumb. This is where you take your best guess based on your experience and knowledge. While this method is not as accurate as the other two, it can still be helpful in getting an estimate.

No matter which method you use to estimate the timing parameters, it is important to be as accurate as possible. This is because even a small error in your estimate could lead to your circuit not working correctly.

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Assignment Task 6: Recommend the architecture and/or algorithm for various datapath operators (e.g. adder, comparator, shifter, multiplier, etc.).

Datapath operators are an essential part of digital circuits and can be designed using various architectures and algorithms depending on the application requirements. Here are some common architectures and algorithms used for various datapath operators:

  1. Adder: The most common architecture used for adders is the ripple carry adder, where each bit’s sum is calculated sequentially using a full-adder circuit. For faster addition, carry look-ahead adder or carry-select adder can be used.
  2. Comparator: Comparators are often implemented using the bit-wise subtraction method, where two binary numbers are subtracted bit-by-bit, starting from the most significant bit (MSB) to the least significant bit (LSB), and the result is checked to determine which number is greater. Another method is the bit-wise XOR method, where two binary numbers are XORed bit-by-bit, starting from the MSB to the LSB, and the result is checked to determine if the numbers are equal.
  3. Shifter: Shifting operations can be implemented using various algorithms such as barrel shifters, serial shifters, or parallel shifters. Barrel shifters use a series of multiplexers to perform shifting operations. Serial shifters shift each bit one at a time, while parallel shifters shift multiple bits simultaneously.
  4. Multiplier: There are several architectures for implementing a multiplier, including the array multiplier, Wallace tree multiplier, and Booth multiplier. The array multiplier is the simplest architecture, but it requires a large number of adders. The Wallace tree multiplier reduces the number of partial products required by combining smaller groups of bits before summing them. The Booth multiplier uses a combination of shifting and addition/subtraction to perform multiplication, which reduces the number of partial products required.
  5. Divider: Division can be implemented using various algorithms such as restoring division, non-restoring division, and SRT division. Restoring division and non-restoring division are iterative algorithms that require multiple cycles to complete, while SRT division is a single-cycle algorithm that uses precomputed values to speed up the division process.

These are just a few examples of architectures and algorithms for datapath operators. The choice of architecture and algorithm depends on the specific requirements of the application, such as speed, area, and power consumption.

Assignment Task 7: Compare the different types and architectures, operation and circuit implementations of memories.

Memories are essential components of any digital system. They are used to store data, instructions, and other information required by the system to perform its tasks. There are several types and architectures of memories available, and each one has its advantages and disadvantages. In this answer, I will compare the different types and architectures of memories, their operation, and circuit implementations.

  1. RAM (Random Access Memory): RAM is a volatile memory that can be read and written to randomly. It is used to store data and instructions temporarily while the system is running. The most common types of RAM are DRAM (Dynamic RAM) and SRAM (Static RAM). DRAM requires frequent refreshing, while SRAM does not. DRAM is cheaper and denser, while SRAM is faster and more power-efficient.
  2. ROM (Read-Only Memory): ROM is a non-volatile memory that can only be read. It is used to store the firmware, BIOS, and other critical data required by the system. There are several types of ROM, such as PROM (Programmable ROM), EPROM (Erasable PROM), EEPROM (Electrically Erasable PROM), and Flash Memory. PROM can be programmed only once, while EPROM can be erased and reprogrammed using ultraviolet light. EEPROM and Flash Memory can be erased and reprogrammed electronically.
  3. Cache Memory: Cache Memory is a small and fast memory that is used to store frequently accessed data and instructions. It is located closer to the CPU than the main memory, and its purpose is to reduce the access time to the main memory.
  4. Virtual Memory: Virtual Memory is a technique used by the operating system to manage the main memory more efficiently. It allows the system to use the hard disk as an extension of the main memory. The virtual memory is divided into pages, and only the required pages are loaded into the main memory when needed.

Memory architectures can be categorized into two categories based on the way they are organized – the hierarchical and flat architectures.

  1. Hierarchical Memory Architecture: Hierarchical Memory Architecture is a memory organization that uses multiple levels of memory with different access times and capacities. It includes registers, cache memory, main memory, and secondary storage. The purpose of this architecture is to provide a fast and efficient memory system that can meet the performance requirements of the system.
  2. Flat Memory Architecture: Flat Memory Architecture is a memory organization that uses a single-level memory system with a uniform access time and capacity. It is used in small systems where the memory requirements are low.

Memory circuits can be implemented using different technologies, such as magnetic, optical, semiconductor, and molecular.

  1. Magnetic Memory: Magnetic Memory uses magnetic fields to store and retrieve data. It includes hard disks, floppy disks, and magnetic tape.
  2. Optical Memory: Optical Memory uses light to store and retrieve data. It includes CDs, DVDs, and Blu-ray discs.
  3. Semiconductor Memory: Semiconductor Memory uses semiconductor technology to store and retrieve data. It includes RAM, ROM, and Flash Memory.
  4. Molecular Memory: Molecular Memory uses molecules to store and retrieve data. It is a relatively new technology that is still under development.

Assignment Task 8: Implement logic function using PLA / ROM.

A Programmable Logic Array (PLA) and a Read-Only Memory (ROM) are two types of digital circuits that can be used to implement logic functions.

To implement a logic function using a PLA, we can follow these steps:

  1. Define the truth table of the logic function.
  2. Write the Boolean expression for the logic function.
  3. Create two sets of minterms and maxterms from the Boolean expression.
  4. Use the sets of minterms and maxterms to create the AND and OR arrays of the PLA.
  5. Connect the outputs of the AND array to the inputs of the OR array to complete the PLA circuit.

Here’s an example of implementing a logic function using a PLA:

Let’s say we want to implement the following logic function using a PLA:

F(A,B,C) = Σ(1,2,4,6)

Truth table:

A B C F
0 0 0 0
0 0 1 1
0 1 0 1
0 1 1 0
1 0 0 1
1 0 1 0
1 1 0 1
1 1 1 0

Boolean expression:

F(A,B,C) = A’B’C’ + A’B’C + AB’C + ABC’

Sets of minterms and max terms:

Minterms: m1 = 1, m2 = 2, m3 = 4, m4 = 6

Maxterms: M1 = A’B’C’, M2 = A’B’C, M3 = AB’C, M4 = ABC’

AND and OR arrays of the PLA:

AND array:

A B C
m1 1 1 1
m2 1 1 0
m3 0 1 1
m4 0 0 1

OR array:

F 1 1 1 1

Connect the outputs of the AND array to the inputs of the OR array to complete the PLA circuit.

To implement the same logic function using a ROM, we can follow these steps:

  1. Define the truth table of the logic function.
  2. Assign a unique binary address to each row of the truth table.
  3. Store the output of the logic function for each row at the corresponding address location in the ROM.

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